KOSTECSYS | 코스텍시스

Company Name	KOSTECSYS
Booth Number	B129
Home Page	www.kostec.net
Main Phone	032-821-0162

Company Introduction

The Global Leading Company of Low Thermal Expansion and High Thermal Conductivity Materials for SiC and GaN Next-
Generation Power Semiconductors In Electric Vehicles, 5G Communication, Radar, Robots, Aerospace, and Military, 
KOSTECSYS is Growing as a Core Material Company.

Introduction of item

1. POWER DEVICE RF PACKAGE, QFN, MMIC/Hermetic Package

Ni400, Ni780, Ni880, Ni1230 and etc
KOSTECSYS provides ceramic to metal brazing packages for RF and microwave modules.
Ceramic with low electrical resistance and heat sink with high thermal conductivity are available for high power.

2. Low CTE, High thermal conductivity material heatsink flange, spacer, carrier

SCMC (Super-CMC): Cu (copper) and Mo (molybdenum) Multi-layered structure with low thermal expansion coefficient and 
thermal conductivity It's a new material with excellent heat dissipation Communications, automobiles, defense, aerospace, 
medical, energy, and other semiconductors. We produce and supply heat sinks for packaging