LASERSSEL | 레이저쎌

Company Name	LASERSSEL
Booth Number	E155
Home Page	www.laserssel.com
Main Phone	031-8060-3325

Company Introduction

Laserssel Corporation is a leading provider of Area Laser selective reflow technology supporting global industrial segments.
As a pioneer in selective soldering segment, Laserssel has provided customers with unique soldering capabilities solving 
various problems in many other challenges that were difficult, if not impossible, in conventional reflow process.

Introduction of item

1. LSR (Laser Selective Reflow)

Laser Reflow Equipment with outstanding performance and productivity for advanced semiconductor(DRAM/NAND Flash 
memory, CoWoS and heterogeneous advanced packaging), electrical components on electrical vehicle and other SMT 
components, replacing existing mass reflow.
PCB Size : 240 x 80 mm / 300 x 300 mm
Beam Size : 240 x 80 ~ 300 x 300 mm (Variable)
Beam Uniformity : > 90%

2. LCB (Laser Compression Bonder)

World’s first Advanced Package(Heterogeneous advanced package(CoWoS)/HBM) Equipment with Warpage-free packaging 
process replacing existing TC Bonder using Area Laser Compression bonding and high accuracy robot-controlled 
Compression Unit.
PCB Size : 80 x 240 ~ 100 x 100 mm (Variable)
Beam Size : 120 x 120 mm 
Beam Uniformity : > 90%