SP SEMICONDUCTOR & COMMUNICATION | 에스피반도체통신

Company Name	SP SEMICONDUCTOR & COMMUNICATION
Booth Number	C147
Home Page	www.spsemi.co.kr
Main Phone	032-680-7777

Company Introduction

SPsemi is pursuing challenges and innovations. As a technical leader in power semiconductor assembly, we aim to comply 
with the standards of quality and environmental management systems and create value for our customers.

Introduction of item

1. TO-Series, SOT-227, DSC Module(Power Discrete/Module)

- Various Wafer sizes can be mass-produced (4~12 inch, Thickness 45~580㎛)
- It has BOM technology aimed at high reliability such as MSL-1, AEC-Q101
- Securing DSC Molding mass production technology with Vacuum Reflow Recipe

2. Full-Auto Plating Service (Sn & Ni)

- Securing Korea's only DSC-specific auto electro plating system
- De-Flash without PKG breakage with introduction of water-jet system
- Average plating thickness Sn 5.09㎛, Ni 2.53㎛ and plating layer satisfies Cpk 3.04~3.50