THE GOODSYSTEM | 더굿시스템

Company Name	THE GOODSYSTEM
Booth Number	A125
Home Page	www.thegsystem.co.kr
Main Phone	031-494-2522

Company Introduction

We have successfully commercialized the world's highest performance copper-diamond composite material with a thermal 
conductivity of 1000W/mK. We are developing products that meet customer needs and creating new value, especially in 
applications such as CPU components, 5G/6G wireless communications, EVs, and AI. As a result, we are providing heat 
spreaders for semiconductor packages with the world's highest performance to global customers.

Introduction of item

1. arCuDia CPU 4035(Cu-Diamond Components for CPU Packages)

◈ CPU components using Cu-Diamond composite with 1000W/mK thermal conductivity 
◈ Applied to Intel's latest CPU to reduce maximum temperature by 12℃ and improve performance
◈ intel CORE i9-13G 13900K (Raptor Lake) performance : 38305  42281 points achieved (CINEBENCH score)

2. arCuDia RF 1515(Cu-Diamond Components for RF wireless communiction)

◈ RF wireless communication parts using Cu-Diamond composite material with thermal conductivity of 1000W/mK. 
◈ Reduced the device temperature by 60 degrees by applying it to 1300W-class communication devices
◈ Passed the reliability of the US defense MIL-STD-883K-C standard (Thermal cycling test, -65 ~ +150℃, 1,000 cycles)