KOSTEK SYSTEMS | 코스텍시스템

Company Name	KOSTEK SYSTEMS
Booth Number	E116
Home Page	www.kosteks.com
Main Phone	031-646-1500

Company Introduction

We contributed to the semiconductor industry by localizing the Vacuum Cluster System required for the semiconductor fab 
equipment at the first time in Korea.
In addition, as results of continuous R&D for business diversifications, we are localizing the next-generation semiconductor 
packaging equipment (TSV, Fan-out) such as Wafer to Wafer bonder & De-bonder, and selling them to the customers of 
semiconductor companies.

Introduction of item

1. Temporary Wafer Bonding System

This is a system that temporarily bonds a Carrier Wafer (Glass) to the front of a wafer for processes such as Wafer Back 
Grinding/RDL/Bump in TSV Wafer Level Packaging.

2. Wafer De-Bonding System

This is a system that separates the temporarily bonded Carrier Wafer from the Device Wafer after completing the Back 
Grinding/RDL/Bump process in TSV Wafer Level Packaging.