NANO FINE TECH | 나노화인테크

Company Name	NANO FINE TECH
Booth Number	C112
Home Page	www.nanofine.co.kr
Main Phone	031-340-3581

Company Introduction

"NANO FINE TECH is the Korean distributor of Japan's TAKAOKA TOKO.
TAKAOKA TOKO is a leading company of 3D bump height inspection system for advanced semiconductor packaging. TAKAOKA TOKO 
unique multi-beam confocal method applied 3D sensor is used for inspection system and its performs inspection with high speed and 
accuracy."

Introduction of item

1. Wafer Bump Inspection System(WVI-S10330-RA)

"TAKAOKA TOKO Wafer Bump Inspection System is for micro bumps mounted on 300mm wafer and perform high speed and accuracy. 
Target bump size is over 12μm diameter (min.), over 25μm in bump pitch (min.) and tageting 10WPH for throughput.
(This is target spec for tool design. Need customer's sample evaluation for actual performance.)"

2. Thermal Warpage Inspection System(HVI-S10000C-RC/EC)

"HVI system can measure substrate warpage in a special tray with high speed and accuracy for various temperature environments, 
making a controlled temperature profiles.
As well as substrate warpage, bump / ball / LGA heights and flatness can all be measured simultaneously. Applicable both for round and 
flattened bumps."