TOMOCUBE | 토모큐브

Company Name	TOMOCUBE
Booth Number	J114
Home Page	www.tomocube.com
Main Phone	042-863-1100

Company Introduction

Tomocube, Inc. specializes in Holotomography (HT), an optical technology capable of imaging the internal 3D structure of samples. 
Utilizing both our highly recognized transmission HT technology in the biotechnology field and our world-first reflective HT technology, 
we provide non-destructive inspection and measurement solutions for Glass substrate and Hybrid bonding.

Introduction of item

1. 3D Scanner for Glass Substrate(HT-T1)

Non-destructive 3D Inspection and Measreument of Glass Substrate
- Measurement of roughness on the inner walls of TGV (Through Glass Via)
- Inspection of micro cracks within the glass
- Examination of glass deformation caused by laser modulation
- Applications : Glass substrate, Carrier Glass, XR/AR Glasses, UTG Cutting

2. 3D Scanner for Glass Substrate(HT-T1)

Non-destructive 3D Inspection and Measreument of Glass Substrate
- Measurement of roughness on the inner walls of TGV (Through Glass Via)
- Inspection of micro cracks within the glass
- Examination of glass deformation caused by laser modulation
- Applications : Glass substrate, Carrier Glass, XR/AR Glasses, UTG Cutting

3. 3D Scanner for Semiconductor Inspection and Measurement(HT-R1)

Non-destructive 3D Imaging of Semiconductors/Displays
- Simultaneous measurement of SiO2/Cu surface roughness in hybrid bonding structures
- 3D inspection and measurement of underlying structures beneath transparent layers (SiO2, PI, Build-up Film, etc.)
- Thickness measurement of transparent layers and step height measurement of opaque layers
- Applications : Hybrid bonding, OLED, MicroLED, Build-up Film

4. 3D Scanner for Semiconductor Inspection and Measurement(HT-R1)

Non-destructive 3D Imaging of Semiconductors/Displays
- Simultaneous measurement of SiO2/Cu surface roughness in hybrid bonding structures
- 3D inspection and measurement of underlying structures beneath transparent layers (SiO2, PI, Build-up Film, etc.)
- Thickness measurement of transparent layers and step height measurement of opaque layers
- Applications : Hybrid bonding, OLED, MicroLED, Build-up Film