JMJKOREA | 제엠제코

Company Name	JMJKOREA
Booth Number	F122
Home Page	www.jmjkorea.com
Main Phone	070-4165-0160

Company Introduction

"1. The first semiconductor company in the metropolitan area to relocate its headquarters at the same time as expanding the power 
module package mass production plant in the radiology, medical and science general industrial complex in the southeastern region of 
Busan.		
2. Development and production of clips, a core material for connecting power semiconductor devices (supplied to the world's top 10 
power semiconductor companies - 85% of sales are exported overseas)		
3. Possesses a mass production line for core technology in the power semiconductor packaging field		
4. Locally produced brand of power semiconductors developed/manufactured in-house		
5. Anchor company that contributed to being attracted to the ‘Power Semiconductor Materials and Materials Specialty Complex’ (the 
only one in Korea)"

Introduction of item

1. Core material for electrical connection of power semiconductor devices(Interconnection Clip and Clip Bonding technology)

"By applying clip bonding technology using clip materials to the production of power module packages, This product line is unique in 
improving the efficiency of power semiconductors by improving fatigue life and maximizing the heat dissipation effect through electrical 
connection compared to wire bonding and spacer bonding technologies.
In Korea, only JMJKOREA Co., Ltd. manufactures and sells this product, making it a core technology that can replace conventional 
technologies."

2. For power conversion devices Power module package and Water Jacket(SFDSC(Safety Dual Side Cooling) Power Module Package)

"It is a double-sided heat dissipation cooling package module technology equipped with Korea's first 1200V SiC semiconductor device to 
reduce the volume and weight of the E-Mobility powertrain system, increase energy efficiency, and improve thermal resistance reliability. 
The cooling effect was further improved by attaching a pinfin structure to maximize the heat dissipation effect on the insulating 
substrate to which the SiC element is attached, and then allowing the coolant to cool the pinfin structure directly. As a module package 
technology to manufacture inverters for electric vehicle drive motors, we developed a water jacket including a water cooling system with 
good heat dissipation performance equipped with a SiC MOSFET module."