GANA | 가나

Company Name	GANA
Booth Number	K108
Home Page	www.ganatr.co.kr
Main Phone	031-398-5110

Company Introduction

"As a company specializing in cutting-edge bonding solutions, we provide a variety of high-performance adhesives and curing 
equipment.
Precision die bonder, flipchip bonder, wire bonder, advanced equipment, etc.
This company provides One Bonding Solution."

Introduction of item

1. Sub-micron Die bonder(Pico2)

"The FINEPLACER® pico 2 is a multi-purpose, manual die bonder with placement accuracy down to 3 µm. Quick to set up and easy to 
operate, the system is ideal for fast and flexible product development and prototyping in R&D labs and universities."

2. Vacuum Reflow Solder system(Reflow Solder System)

"We offer different kind of table top and space saving systems (for R&D use, for prototyping and small series production).
RSO: Reflow Solder Oven RSO-210 (up to 650 °C)
RSS: Mini Reflow Solder System RSS-110-S, RSS-160-S, RSS-210-S (max. temp. 400 °C)
VSS: Vacuum Solder System (up to 400 °C) also for flux"