WOOWON TECHNOLOGY | 우원테크놀러지

Company Name	WOOWON TECHNOLOGY
Booth Number	J107
Home Page	www.wwtech.co.kr
Main Phone	031-783-4770

Company Introduction

“Woowon Technology Co., Ltd” is a Representative and Distributor for major foreign equipment suppliers. Our highly experienced sales 
and support teams provide world-class support that is focused on delighting both our principals and customers. 
We import and supply capital equipment, subsystems, and components from more than thirty manufacturers based all over the world."

Introduction of item

1. Dicing Saw & Blade(80WT)　

"Fully automatic twin spindle dicing saw, designed for precise step-cut for wettable Flank process.
The 80WT performs perfect grooving operation with constant depth of cut and groove shape, on an uneven surface of the substrate 
using an Optical Mapping System (OMS).
The OMS can inspect the cut depth and inspect the cut quality."

2. Wafer Thickness Measurement(SEMDEX)

"Configurations
• Multiple sensors in one system
• Multilayers Thickness, Roughness, Bow, Warpage
• TSV-CD, TSV-Depth, TSV-RST, 3D Topology
• 150, 200, 300, 330mm Wafer + Bridge configuration
• Si-, Taiko-, Taped-, Framed-, Carrier-, eWLB-Wafer
• Different Liner- and Rotary-Stages
• Different Stage Sizes
• Multiple Wafer-chucks
• FFU’s for different Clean-room class
• Loadports Open Cassette, SMIF or FOUP/FOSB
• Vacuum- and Edge Grip Pre-aligner
• Multiple Wafer ID Solutions
• 3-, 4- and 5-Axis Robots with Flip-Options
• Software supports all Configurations
• SECS/GEM and GEM300"

3. Manual wire bonder(ibond5000)

"Specifications
• Bonding Area
135 mm x 135 mm (5.3” x 5.3”)
• Throat Depth
143 mm (5.6”)
• Gross Table Motion
140 mm (5.5”)
• Fine Table Motion
14 mm (0.55”)
• Mouse Ratio 6:1 (Choose Mouse Type)
• Left side mouse with right side manual ‘Z’ lever.
- Recommend optional ‘Portable Dials Kit’
- Locates critical dials on right side
- For operator comfort (Search 1st , Search 2nd , Loop and Tail)
- Right side mouse with left side manual ‘Z’ lever
- Right side mouse with integrated manual ‘Z’ lever
• Motorized Y
• Stepback up to 4 mm (160 mil)
• Reverse up to 0.25 mm (10 mil)
• Kink height up to 0.5 mm (20 mil
• Z Axis Control
DC Servo with closed loop tachometer 
feedback
• Z Axis Travel
• 0.500” (12.5 mm) ‘Z’ travel
• Increased travel range
• Full range of control with the ‘Z’ motor"

4. Semiconductor Failure Analysis Tools(Magma)

"The Magma Scanning SQUID Microscope (SSM) HiRes is a dual magnetic sensor system that extends the SSM tool capability to dies 
(either on full wafers, or in complex 3D TSV or wire bond devices). Magma SSM HiRes creates current images of devices at the die, 
package and PC board level using non-destructive techniques. Current images can then be used in conjunction with optical fiducials and 
design data to localize static defects in three dimensions."

5. Flip chip bonder(FC150)

"Specifications
Machine 
Footprint 1890 x 1300 mm
Height 2060 mm
Weight 2300 kg
Component size
Chip (Upper die) 0.2 x 0.2 – 100 x 100 mm
Thickness up to 6 mm
Substrate / Wafer (Lower die) 0.5 x 0.5 – 200 x 200 mm
Thickness up to 6 mm
Bonding arm
Placement accuracy* ± 0.5 µm
Post-bond accuracy* ± 0.7 µm
Leveling Travel: ± 0.2 degree
Force 0.25 up to 2000 N
Alignment stage
XY stage 550 x 320 mm
Theta travel ± 7 degrees"