SAMSUNG ELECTRONICS | 삼성전자

Company Name	SAMSUNG ELECTRONICS
Booth Number	G132
Home Page	semiconductor.samsung.com/
Main Phone	02-2255-0114

Company Introduction

Samsung Electronics has restructured into two divisions, DX and DS, based on product types. DS division is responsible for memory 
semiconductor, Foundry, and System LSI businesses, manufacturing and selling semiconductor components such as DRAM, NAND Flash, 
and mobile APs.

Introduction of item

1. (Smart Fab)

This content introduces the history and product lineup of Samsung Electronics' General Test and System Package (TSP) business, as well 
as introduces the fully-automated Back-End Fab process of DS division. Through this content, we are presenting not only the leading 
back-end manufacturing technology of TSP, but also the DS division's goal for the next-generation Smart Fab.

2. -

This content contains an introduction to Samsung Electronics DS division's next-generation packaging technology, AI-oriented 2.5D and 
mobile-oriented FOPKG. You will also be able to see the technology for high thermal dissipation PKG that shows differentiated thermal 
resistency by using Exposed Silicon technology.