AP SYSTEMS | 에이피시스템

Company Name	AP SYSTEMS
Booth Number	C114
Home Page	www.apsystems.co.kr/
Main Phone	031-379-2700

Company Introduction

AP Systems Co., Ltd. has secured cutting-edge equipment technologies and differentiated solutions not only for semiconductor 
manufacturing equipment that integrates Thermal, Laser and Plasma technologies but also for OLED, Secondary Cell Battery, and Solar 
Cell.

Introduction of item

1. Sputter(KORONA TM PVD)

With the trend of increasing capacity, speed, and miniaturization of semiconductor devices, semiconductor packaging technology is also 
shifting from traditional wire bonding to flip-chip methods. Recently, it has been evolving into FOWLP (Fan-out Wafer Level Package), 
FOPLP (Fan-out Panel Level Package), and 3D packaging. AP Systems supplies sputtering equipment for the production of metal films 
(CPB UBM, RDL) to customers in line with the advancements in semiconductor packaging technology.

'Features'- Application for RDL(Redistribution Layer)
- Maximum Productivity
- Warpage / Glass / Thin Wafer Handling

2. Laser De-bonder(KORONA TM LD)

It is manufacturing process equipment that separates device substrates and carrier substrates using laser, optical technology, and process 
modules in semiconductor HBM / WLP / PLP manufacturing processes. 

Features
- Field proven high power Excimer Laser and DPSS Laser system                                                                                                                                   
- Homogenized line beam delivery system / Spot beam Delivery System
- Compact system design for small foot print                                                                                                                       
- Complete automation & control solution with EasyCluster™ software