DAWON NEXVIE | 다원넥스뷰

Company Name	DAWON NEXVIE
Booth Number	G102
Home Page	nexview.co.kr/
Main Phone	031-8085-7899

Company Introduction

Daewon Nexview Co., Ltd. is a manufacturer of automated equipment based on laser application technology. We offer the "pLSMB 
product line," which enables bonding of probes onto semiconductor probe cards. Additionally, we provide the "sLSMB product line" for 
bonding solder balls on substrates, and the "dLSMB product line" for processing related to next-generation displays and solar 
technologies.

Introduction of item

1. LASER MICRO BUMP REPAIR(LZ-5000)

SOLDER BALL SIZE: 40~80㎛ 
AUTO FOCUS VISION
BUMPPING ACCURACY ≤±5%

2. High Speed Bonder(LB-10000)

DAILY PRODUCTION CAPACITY : 10,000 Pin
AUTO FOCUS VISION
Position Accuracy : ≤±5㎛ , ≤±8㎛