BS TECHNICS | 비에스테크닉스

Company Name	BS TECHNICS
Booth Number	G102
Home Page	www.bespokeplanet.kr
Main Phone	031-8042-7300

Company Introduction

It is a company that develops products and solutions to major domestic as well as overseas clients by developing application products 
and materials necessary for semiconductor package bonding, electric vehicles and batteries using technologies such as ISB (Selective 
Bonding Thru Induction), LCT (Laser Circuit Technology), MDM (Direct Mound on Mold), and materials used in electric vehicles and 
batteries.

Introduction of item

1. Silicone Paste(BST1300GA)

Due to the excessive use of electricity in AI-related chips and boards, which are currently in high demand worldwide, the need for 
products with excellent vertical heat conduction is increasing, and a high heat dissipation product of 13W/m.K, a paste type that can be 
attached directly to the chip, is required

2. (Development of semiconductor chip bonding technology using magnetic induction through testbed utilization)

A method for joining components or semiconductor chips vulnerable to heat and pressure through soldering with non-contact magnetic 
induction selective heating.
It can be used for CPU, AP, AI, flip chip semiconductor joining, heterojunction, and film joining by minimizing thermal stress in the non-
heated area of the substrate and improving warpage.