YIELD ENGINEERING SYSTEMS | 일드엔지니어링시스템즈

Company Name	YIELD ENGINEERING SYSTEMS
Booth Number	I114
Home Page	www.yes.tech
Main Phone	031-723-0126

Company Introduction

Yield Engineering Systems, Inc. (YES) is a leading provider of high-tech, cost-effective equipment for enhancing surfaces and materials. 
The company's product lines include thermal processing systems, chemical vapor deposition (CVD) systems, and wet process 
equipment used for the precise surface modification of semiconductor substrates, semiconductor and MEMS devices, LED displays, and 
biodevices. Customers ranging from startups to Fortune 100 companies rely on YES systems to create and volume-produce innovative 
products in a wide range of markets. YES is headquartered in Fremont, California, with a growing global presence.

Introduction of item

1. VertaCure XP G2(PI/PBO curing equipment for Semicondutor process)

3.5hours vs. 8+hours for atmospheric
Laminar flow reduces/elimiates particles
More complete cure(5x less outgassing)
Less film stress and low wafer warpage
1.6x to 2x less power and N2 Consumption
Much lower capital cost, 2-3x lower CoO

2. VeroTherm FAR equipment(Formic acid reflow equipment for Semiconductor process)

Industry's best reflow performance extendable to sub-55um (down to 12um) bump pitch, multi-substrate die stacks. Low vacuum 
technology enables wicking-free reflow for high aspect ratio (>75% reflowed bump height/diameter) bumps across wafer and die 
locations. Designed to minimize formic usage per wafer, and to prevent salt formation inside the chamaber that causes wafer surface 
contamination. Prevents thermal shock wafer breakage by utilizing convective N2 cooling and radiation. High throughput and Low CoO