KOVIS TECHNOLOGY | 코비스테크놀로지

Company Name	KOVIS TECHNOLOGY
Booth Number	G120
Home Page	www.kovistechnology.com
Main Phone	02-3397-3563

Company Introduction

KOVIS is a leading manufacturer of advanced MI equipment that provides high-precision, productivity and reliability metrology and 
inspection equipment at reasonable product costs for the global semiconductor, display and electronics industries. We develop, 
manufacture and supply advanced metrology equipment for research and manufacturing processes in the fields of Wafer FAB, Wafer 
Level Packaging and IC Packaging, which are highly integrated semiconductor IC manufacturing processes used in a wide range of end-
user markets including semiconductors, electrical and electronic, mobile internet, computing, automotive, LED and solar energy.

Introduction of item

1. ATLAN ( Advanced Scanning Acoustic ?Tomography? )

ATLANTM is a next-generation automated system utilizing advanced Scanning Acoustic Tomography (SAT) for fast, precise, and non-
destructive internal defect detection in components like semiconductors and electronic parts.
▶Key Features :
①Precise & Rapid Inspection: Fast, accurate inspection of fine layers via advanced SAT 
  and dual linear motors. 
②Non-Destructive Inspection: Detects internal defects without product damage. 
③Diverse Defect Detection: Identifies voids, separations, delaminations, and cracks. 
④Customized Data Analysis
⑤Cutting-Edge Hardware: Proprietary transducers/pulsers provide clear images and max 
  penetration. 
⑥High Performance: High-res, high-speed, fully digital analysis (e.g., 1200mm/s scan, 3GHz sampling). 
⑦Flexible Configuration: Supports various modes and up to 6-axis control.

2. WARP SERIES (THICKNESS & WARPAGE METROLOGY)

The WARP™ Series is a non-contact, high-precision wafer shape measurement system that measures wafer thickness, Total Thickness 
Variation (TTV), flatness, 
bow, and warp with nanometer resolution.
▶Key Features :
①High-Precision Non-Contact Measurement: Measurement accuracy ≤ ±0.25μm @ 10nm resolution
②Wide Range of Sample Measurement: Bare, Pattern wafer, Back grinding-ring framed on-tape wafer,   
   ultra-thin, Taiko wafer, Bumped wafer, Glass, Sapphire, Ge, GaAs, InP, Solar, FPD, Strip, PCB, etc.
③Measurement of Challenging Materials: Measures various materials including mirror
   irregular reflection, and rough surfaces.
④Multiple Sensor Integration: Performs diverse measurements with a single system 
   (RT-3500: Thickness + Roughness).
⑤E-mapping Automatic Measurement: Quickly measures by loading easily created e-mapping recipes.
⑥One-click Simple Measurement: Measures at once with a user-friendly Windows-based program.
⑦Intuitive User Interface: Displays 2D/3D graphic results for easy understanding.
⑧SPC Analysis: Provides statistical process control functions such as minimum, maximum, average, 
   TTV, and STD.Dev.
⑨Various Measurement Options: Options for surface roughness, 3D shape and dimension, and
   transparent thin film thickness measurement.
⑩Automation Options: Semi-automatic to fully automatic customized systems available depending on
   the measurement material.