DAWON NEXVIEW | 다원넥스뷰

Company Name	DAWON NEXVIEW
Booth Number	F102
Home Page	www.nexview.co.kr
Main Phone	031-8085-7899

Company Introduction

Dawon Nexview is a manufacturer of automated equipment based on laser application technology. Based on LSMB (Laser Systemic 
Micro-Bonding) technology, we offers the "pLSMB product line," which bonds probes to semiconductor probe cards with high precision; 
the "sLSMB product line," which bonds micro solder balls to semiconductor substrates; and the "dLSMB product line," which performs 
precision processing for next-generation displays and perovskite solar cells.

Introduction of item

1. LZ-5000D(Laser BGA Bump Mounter)

Max. 12 Solder Ball Jetting / sec
High Precise 3D Auto Focus Vision
Dual Laser Jetting Head
Capable of Solder Ball size 45um ~ 700um

2. LZ-5000(Laser Micro Bump Repair)