WOOWON TECHNOLOGY | 우원테크놀러지

Company Name	WOOWON TECHNOLOGY
Booth Number	D112
Home Page	www.wwtech.co.kr
Main Phone	031-783-4770

Company Introduction

“Woowon Technology Co., Ltd” is a Representative and Distributor for major foreign equipment suppliers. Our highly experienced sales 
and support teams provide world-class support that is focused on delighting both our principals and customers. 
We import and supply capital equipment, subsystems, and components from more than thirty manufacturers based all over the world.

Introduction of item

1. 80WT(Dicing Saw & Blade)

Product Introduction
Advanced Dicing Technologies (ADT) provides high-precision dicing solutions for the semiconductor, microelectronics, optics, and 
MEMS industries. ADT systems deliver nanometer-level repeatability, optimized cutting for each material, and full automation, 
meeting the most demanding requirements of advanced dicing applications.

Key Advantages
   * Handles wafers up to 12 inches with advanced water circulation and filtration systems
   * Air-bearing spindles up to 60,000 rpm for precise and stable cutting
   * Automatic cut-depth measurement ensures consistent quality
   * Seamless integration with FAB environments for real-time data communication
   * UV LED curing system for high-quality dicing results

Applications
   * Resin bond dicing blades optimized for thin-package precision cutting
   * Novus blades with higher strength and durability to minimize chipping, breakage, and warpage
   * Precision cutting of hard materials such as glass and sapphire
   * Specialized solutions for ceramic substrates and other challenging materials

2. SEMDEX(Wafer Thickness Measurement)

Product Introduction
Sentronics Metrology GmbH is a specialist in precision optical metrology systems for the semiconductor industry.
The company provides accurate measurements of 3D shape, thickness, surface roughness, and TTV/Bow-Warp for wafer 
manufacturing and advanced packaging processes.

Key Advantages
   * Non-contact interferometry for precise wafer thickness and 3D shape measurement
   * Detects nanometer-level surface roughness and height variation
   * Evaluates multi-layer thin film structures and surface characteristics
   * Supports real-time process monitoring during production changes
   * Designed for advanced packaging such as FOWLP, 3D TSV, and reconstituted wafers
   * SECS/GEM interface for seamless FAB data integration

Applications
   * Measurement of total wafer thickness and flatness (TTV, Bow/Warp)
   * Analysis of TSV position, height, and surface planarity
   * Verification of bonding quality and thickness uniformity
   * Thin-film thickness measurement and reflectivity analysis

3. ibond5000(Manual wire bonder)

Product Introduction
MPP specializes in developing and manufacturing manual wire bonders for precision electronics assembly and R&D.
These systems are suitable for a wide range of applications, including optoelectronics, hybrids, MCM, microphones, chip-on-board 
(CoB), and sensors. Based on the proven mechanical design of the K&S 4500 series, MPP wire bonders deliver high yield and excellent 
repeatability.

Key Advantages
   * Control system powered by Cortex A9 dual-core CPU
   * Windows CE-based operating system
   * Precise wire bonding using DC servo motors and ultrasonic system
   * 7-inch TFT touchscreen for intuitive operation
   * Compatible with various wire and ribbon sizes/materials
   * Save and load user-defined profiles
   * Automatic wire refeed function
   * Closed-loop control with DC servo motors
   * PLL ultrasonic generator with high-Q transducer

Applications
   * Assembly of optoelectronic devices such as LEDs, laser diodes, and photodetectors
   * Multi-Chip Module (MCM) packaging
   * Assembly of RF and microwave chips and modules
   * Chip-on-board (CoB) packaging directly on PCBs
   * Integration of sensors, LED displays, and MEMS devices
   * Assembly of power devices, sensors, transistors, and ICs

4. Magma(Semiconductor Failure Analysis Tools)

Product Introduction
Neocera Magma LLC is a specialist in semiconductor failure analysis using non-destructive magnetic field imaging. With advanced 
SQUID (Superconducting Quantum Interference Device) and GMR (Giant Magnetoresistance) sensor systems, the company can 
precisely detect defects in next-generation electronic devices at the chip package and PCB level.

Key Features
   * Detects electrical defects at chip, package, and PCB level with high-resolution magnetic field imaging, without damaging the 
device
   * SQUID sensors capture extremely small currents
   * GMR sensors scan magnetic fields with very high spatial resolution
   * Uses Space Domain Reflectometry (SDR) to detect defects with high-frequency signals
   * Combines:
       - SQUID for ultra-sensitive detection
       - GMR for ultra-high resolution
       - SDR for intelligent defect detection
   * Provides a non-destructive, 3D, smart analysis platform optimized for advanced semiconductor packaging and wafer FA (failure 
analysis)

Applications
   * 3D integrated circuits and TSV-based interposer packages
   * Reliability testing and defect analysis in high-speed data circuits
   * Electrical fault detection in automotive safety and control systems
   * Failure analysis in servers and data center equipment
   * Defect detection in tablets and wearable devices

5. FC150(Flip chip bonder)

Product Introduction
SET is a France-based manufacturer of high-performance flip-chip bonders. It is the only company in the world capable of achieving 
±0.5 µm post-bonding accuracy, and works closely with global research institutes and industries to advance technology and expand 
applications.

Key Advantages
   * Wide bonding force range: from ultra-low to ultra-high pressure
   * Supports room-temperature and high-temperature bonding
   * Compatible with thermal or UV curing adhesives
   * Hybrid bonding of small, large, ultra-thin, and thick components
   * Thermo-compression bonding (C2C, C2W) with ±0.5 µm accuracy
   * Optimized for advanced applications such as IR, UV, X-ray detectors and 3D integration
   * Real-time process control with sub-micron precision

Applications
   * Infrared image sensors for military and aerospace
   * X-ray detectors and particle counters
   * 3D integrated circuits
   * MEMS / MOEMS
   * RF and optoelectronic devices
   * Micro-LED displays
   * Laser diodes and sensors
   * Optical components and photonics

6. MIP(Atmospheric Pressure Microwave Induced Plasma)

JIACO Instruments manufactures leading-edge atmospheric pressure Microwave Induced Plasma (MIP) de-capsulation systems used 
in failure analysis and reliability testing of packaged Integrated Circuits.

Features
   * Provides fully automated Acid-free ATM O2 plasma etching.
   * Guarantees ultra-high quality selectivity.
   * Clean & Safe. Kinder to the Environment.
   * No damage to Si, Metal, Oxide, Passivation.
   * Applicable to all Microchip, Automotive, Defense, Aerospace.
   * Proven capabilities on the most challenging and advanced package failure analysis.
   * MIP increases throughput and efficiency in a lab by removing manual handling steps.

7. ONTOS Clean & IS(Atmospheric Plasma for Surface Preparation)

Product Introduction

ONTOS is an innovative atmospheric plasma surface pre-treatment system that efficiently replaces traditional vacuum systems or wet 
processes. It is not just a cleaning tool – it provides both surface cleaning and activation, making it a next-generation solution.

Features

   *Non-Destructive Cleaning
     Dry plasma cleaning minimizes chemical (wet) usage
     Safely cleans substrates, wafers, and packages without damage

   *Improved Adhesion & Reliability
     Enhances surface energy
     Boosts adhesion and yield in bonding, underfill, coating, and plating processes

   *Eco-Friendly Process
     Reduces use of chemicals → less wastewater and waste
     Environmentally friendly and cost-saving

   *Versatility
     Compatible with various materials (Si, SiC, GaN, Glass, Polymer, Substrates, etc.)
     Proven performance in advanced packaging (3D IC, SiP, WLCSP, FOWLP, etc.)

   *Proven Reliability
     Adopted by leading global semiconductor and OSAT companies
     Verified in both mass production and analysis processes

8. V200 / V300(WAFER Metrology & Inspection - High Resolution Deflectometry)

Product Introduction
DIP-View technology is based on high-resolution deformation measurement (Deflectometry) and is widely used for precise surface 
analysis across different industries.
It plays a key role in improving quality and reliability in semiconductor, automotive, and optical manufacturing.

Features
   * Fast & Cost-Efficient : Analyzes the entire surface in a single measurement, from global scale (mm) to local scale (nm).
   * High Resolution : 20-megapixel resolution covering a 20 mm² area to detect even tiny surface deformations.
   * Large Sample Capability : Supports surface analysis up to 300 mm diameter for quality and reliability control.
   * Nanometer Precision : Detects ultra-fine surface variations at the nanometer level for high-quality production.
   * Versatile Applications : Applicable across multiple industries, including semiconductors, automotive, and optics.
   * Advanced Data Handling : Uses powerful analysis algorithms and supports open data formats for flexible use.

Measurement Capabilities
   * 2D/3D Surface Shape : Form, flatness, bow, warp, and small defects.
   * Surface Roughness & Patterns : Precise measurement of micro-roughness and surface waves.
   * Thin-Film Stress & Defect Mapping : Visualizes stress distribution and defects in thin films for quality assessment.

9. HTX(Wet Etch Processing Tool)

Basic Information
The BatchGlass HTX is a fully automated wet processing tool for cover glass substrates. This tool can accommodate substrates sized 
for different applications from watch over phone to tablet. In batch-style substrates are cleaned, chemically polished or etched and 
dried for a superior product. To achieve a high standard for your products RENA offers sophisticated pre- and post-cleaning processes 
pre and post etching. Our Sophisticated tank design ensures highest homogeneity over each substrate and batch resulting in minimal 
reject. Together with lowest breakage rates the BatchGlass HTX provides the ideal platform for your high volume manufacturing of 
cover glass substrates.

Features and benefits
> Suited for substrates from watch to tablet size
> High stability of the process with online monitoring systems for key parameters
> Tank-in-tank design for improved process homogeneity and reduced space requirement
> Long bath lifetime due to feed-and-bleed function

10. SONATA 1000 / REPRISE 1000(Photonic Wire Bonder (PWB))

Product Introduction
Vanguard Automation leads the next generation of photonic packaging with Photonic Wire Bonding technology.
By enabling direct optical coupling between chips, it overcomes the limits of traditional optical packaging and makes ultra-fast data 
transfer and integrated chip solutions possible.

Features
   * Freeform Optical Coupling between chips to go beyond the limits of conventional packaging
   * High-efficiency optical connections using freeform waveguides and micro-lenses
   * Software-defined flexibility to adapt to different production needs
   * Covers everything from small-scale prototyping to fully automated mass production

Applications
   * Optical devices for high-speed data transmission in fiber-optic communication systems
   * Precision sensor systems for autonomous vehicles and augmented reality devices
   * Optical components for AI chips to enable fast data processing and integration
   * Core devices for quantum computing and communication systems
   * High-reliability optical parts for space communication and defense systems