NEALON | 닐론

Company Name	NEALON
Booth Number	J109
Home Page	www.nealon.co.kr
Main Phone	031-429-4387

Company Introduction

Nealon Co., Ltd supplies package materials, assebmly equipment(Wire Bonder, Die Bonder) and bond test equipment required for post -
semiconductor processing.

Introduction of item

1. 626 Multipurpose Digital Thermosonic Bonder(Specialized wire bonding and die bonding)

HYBOND Model 626 Features
- HYBOND Soft Touch™ bonding technology for improved yields
- Programmable, saveable bond schedules and adaptable reset heights
- Auto-stitch or manual continuous stitch modes for wedge bonding
- Safety or reverse bonds for ball bonding
- Touch sensor-controlled bond actuation for variable bonding height
- Deep vertical access and a wide bonding window for added applications
- Digital temperature controller and high/low power PPL ultrasonic generator
- Convenient swing-away wire/ribbon clamp assembly
- Inertial .5” and 2” spool mounts and motorized feed for superior wire control
- Precise z-axis control
- Optional programmable motorized X-Y operation
- Expandable pick, place and bond performance

2. Customzied electronic solutions and alloys(Metal Bonding Wire & Ribbon, Metal Bond Pads, Preforms, etc)

Solder Preforms, Metal Microstampings, Cover Assemblies, Bond Pads,  Gold Wire and Ribbon, Al wires,  Copper Core Connect™,  
Precision Packaging, Packaging Solutions, etc