PLANOPTIK AG | PLANOPTIK AG

Company Name	PLANOPTIK AG
Booth Number	G113
Home Page	www.planoptik.com
Main Phone	02-0000-0000

Company Introduction

PLANOPTIK sets global standards with glass-based solutions for the semiconductor industry, microsystems, and microfluidics with 
manufacturers in over 40 countries. PLANOPTIK creates customized products that support cutting-edge sensors, microelectronics, and 
medical diagnostics.
 
In advanced packaging, PLANOPTIK’s glass core substrates enable ultra-compact microchip arrangements, enhancing performance, 
energy efficiency and device miniaturization. Its high-precision glass micro circuit boards are key for future semiconductor 
advancements, using copper-coated, lithographically processed glass for critical connections.
 
PLANOPTIK collaborates with its customers to design and produce high-volume, wafer-based components, offering solutions from glass 
wafers to thin-wafer handling tools.

Introduction of item

1. Glass Core Substrates

High-performance glass core substrates for advanced IC packaging—offering superior dimensional stability, low warpage, and excellent 
electrical performance.

2. Glass Substrates for Wafer Level Packaging (WLP)

Glass substrates optimized for WLP, enabling high-density integration, excellent flatness, and thermal stability for next-gen 
semiconductor packaging solutions.