SMITHS INTERCONNECT | SMITHS INTERCONNECT

Company Name	SMITHS INTERCONNECT
Booth Number	B115
Home Page	www.smithsinterconnect.com
Main Phone	02-0000-0000

Company Introduction

Smiths Interconnect is a leading provider of innovative solutions for critical semiconductor test applications. Smiths Interconnect’s test 
sockets and probe card solutions offer superior quality and reliability, providing customers with a competitive advantage.

Our best-in-class engineering and technical expertise ensure the development of cutting-edge test platforms for area array, peripheral, 
wafer level and Package on Package (PoP) devices. Our extensive product portfolio accommodates both devices with finest micro 
pitches and those with very high bandwidth requirements. Off-the-shelf and custom products are proven to deliver the best solution for 
the customer’s specific needs.

Introduction of item

1. DaVinci Gen V high speed test socket

Solution for BGA, LGA and other variants
Spring probe technology using homogeneous alloy with
gold plated for better grounding
RF Bandwidth > 84 GHz @ -1dB IL
Short signal path 4.90 mm test height
Consistent stable contact resistance 55 m (Avg.)
Hi-Coplanarity accommodation
Tri-Temp socket design to support -55 °C to +150 °C

2. Levan elastomeric contact test socket

Solution for BGA, LGA, QFN and other variants
RF Bandwidth > 40 GHz @ -1dB IL
Short signal path  0.9 mm
Ability to do Impedance match signals
Consistent stable contact resistance 100 m (Avg.)
Low Inductance
Optimized design based on test application
Tri-Temp socket design to support -55 °C to +160 °C
Designed for manual test, bench test, and HVM production
test using the same socket