ACM RESEARCH | ACM RESEARCH

Company Name	ACM RESEARCH
Booth Number	I104
Home Page	www.acmr.com
Main Phone	070-8800-6699

Company Introduction

ACM was established in 1998, integrates R&D, manufacturing, and sales, providing front-end process equipment and advanced 
packaging equipment to global customers. ACM’s  main products include single or batch wafer processes, electroplating, stress-free 
polishing, thermal processes, Track，PECVD processes and wafer-level and panel-level package equipment.

Introduction of item

1. Ultra ECP ap-p (ADVANCED PACKAGING PLATING FOR FOPLP)

*Capable to run 510x515mm panel and 600x600mm panel
*Up to 3 Loadports
*Equipped with 2 pre-wet chambers and 2 clean chambers
*Equipped with alignment and CCD edge inspection, as well as flip unit
*Can be equipped with 4-16 plating chambers for copper, nickel, tin-silver gold, etc.
* Warpage≤10mm