SJ COMPANY | 에스제이컴퍼니

Company Name	SJ COMPANY
Booth Number	A124
Home Page	www.sjc2.co.kr
Main Phone	031-203-0642

Company Introduction

SJ Company provides semiconductor and display materials and process services, excelling in multi-process solutions such as glass, 
wafers, and metal deposition and patterning for micro-LED mass transfer bonding. We offer tailored technical support based on 
research collaborations and patents.

Introduction of item

1. TSV/TGVV

TGV (Through Glass Via) is a technology that forms vertical holes in a glass substrate to enable electrical conduction, making it possible 
to implement high-performance, high-density circuits.
It is mainly used in next-generation semiconductor packaging, particularly in interposers, where it serves as the wiring layer between 
the semiconductor chip and the substrate.

TSV (Through Silicon Via) is a semiconductor packaging technology that creates vertical holes through a silicon wafer to connect chips 
together.
This technology plays a key role in enhancing chip performance and integration density, and it is widely applied in high-performance 
semiconductors such as High Bandwidth Memory (HBM).

2. Cu/Sn_Ag Pillar Bump

Cu (Copper) Pillar Bump is a semiconductor packaging technology used to connect chips and substrates.
By utilizing pillar-shaped bumps made of copper, it enables fine pitch interconnection and ensures high reliability.
A key advantage of this technology is that it allows fine pitch connections while maintaining proper spacing between the chip and the 
substrate.

3. TSV/TGV

TGV (Through Glass Via) is a technology that forms vertical holes in a glass substrate to enable electrical conduction, making it possible 
to implement high-performance, high-density circuits.
It is mainly used in next-generation semiconductor packaging, particularly in interposers, where it serves as the wiring layer between 
the semiconductor chip and the substrate.

TSV (Through Silicon Via) is a semiconductor packaging technology that creates vertical holes through a silicon wafer to connect chips 
together.
This technology plays a key role in enhancing chip performance and integration density, and it is widely applied in high-performance 
semiconductors such as High Bandwidth Memory (HBM).