THE GOODSYSTEM | 더굿시스템

Company Name	THE GOODSYSTEM
Booth Number	J113
Home Page	www.thegsystem.co.kr/
Contact	031-494-2522

Company Introduction

TGS has independently developed a Cu-diamond composite with 1000W/m·K thermal conductivity. It provides custom heat spreaders 
for 5G, defense, AI, and X-ray applications, delivering world-class thermal management.

Introduction of Products

1. Cu-Diamond, Ag-Diamond (Cu-Dia, Ag-Dia)

Cu-Dia (Copper-Diamond): Delivers exceptional thermal conductivity of 800–1,000 W/mK. Optimized Cu thickness enables precise CTE 
matching with Si, SiC, and GaN, minimizing thermal stress.

Ag-Dia (Silver-Diamond): Extreme thermal solution for large-size and ultra-thin applications, ideal for aerospace and high-power RF 
devices.

2. Al-Diamond, CVD-Diamond (Al-Dia, CVD-Dia)

Al-Dia (Aluminum-Diamond): Lightweight thermal solution for EVs and future mobility, enabling significant weight reduction compared 
to Cu and Ag.

CVD-Dia (CVD Diamond): As-grown CVD diamond wafer with Cu metallization, delivering ultra-high thermal conductivity and excellent 
electrical insulation.