METASOL | 메타솔

Company Name	METASOL
Booth Number	D103
Home Page	www.metasol.co.kr
Contact	031-831-3787

Company Introduction

MetaSOL specializes in Intense Pulsed Light (IPL) process technology for advanced semiconductor packaging and glass-substrate 
applications. We provide light-based process solutions for photonic debonding and TGV (through-glass-via) copper interconnect 
processes. By replacing conventional thermal, laser, and chemical processes with controlled light-flash processing, MetaSOL enables 
faster, low-temperature, and low-damage manufacturing. We turn light into manufacturing competitiveness.

Introduction of Products

1. IPL Photonic Debonding Solution

A light-based debonding solution that uses Intense Pulsed Light (IPL) to release wafers or substrates from carriers in advanced 
semiconductor packaging processes. It replaces conventional thermal, laser, and chemical debonding methods, enabling low-
temperature, low-damage, and dry processing for temporary bonding/debonding and wafer-release applications.

2. TGV Cu Paste Filling & IPL Sintering Solution

A process solution for forming conductive copper vias and interconnects by filling TGV (Through-Glass-Via) holes in glass substrates with 
Cu paste and sintering them using IPL. This approach can reduce the need for complex seed-layer formation, plating lines, and high-
temperature thermal processes, supporting next-generation glass-substrate packaging applications.