ZEISS | 자이스 코리아

Company Name	ZEISS
Booth Number	H114
Home Page	www.zeiss.co.kr/microscopy
Contact	02-1661-3140

Company Introduction

ZEISS is a global leader in optical technology headquartered in Oberkochen, Germany. Founded by Carl Zeiss in 1846, the company has 
continued to drive innovation for over 175 years. ZEISS provides solutions across semiconductor manufacturing, industrial quality & 
research, medical technology, and consumer optics. Its portfolio includes lithography optics, precision measurement equipment, 
ophthalmic and surgical solutions, and consumer products such as eyeglass and camera lenses. As of September 2023, ZEISS achieved 
record sales of 10.1 billion euros and invests around 15% of its revenue annually in R&D, holding over 11,300 patents. With over 43,000 
employees in more than 50 countries, ZEISS continues to inspire and create value worldwide.

Introduction of Products

1. Microscopy (ZEISS Xradia Versa X-ray Microscope (Versa XRM))

The Xradia Versa XRM is an X-ray microscope that enables high-resolution, non-destructive 3D imaging of a wide range of materials. It 
allows detailed observation of complex internal structures at the nanometer scale, supporting precise analysis across various fields 
such as battery research, semiconductors, and materials science without damaging the sample.

Provides 3D X-ray imaging with nanometer-scale resolution

Accommodates samples of various sizes and densities

Broad application across materials science, energy, electronics, and life sciences

Enables precise analysis through non-destructive imaging

2. Microscopy (ZEISS Crossbeam Focused Ion Beam-Scanning Electron Microscope (Crossbeam FIB-SEM))

The Crossbeam FIB-SEM combines high-performance Focused Ion Beam (FIB) and Scanning Electron Microscopy (SEM) to deliver 
advanced nanoscale machining and high-resolution 3D analysis. It enables fast and precise cross-sectioning, TEM sample 
preparation, and 3D reconstruction, particularly for semiconductor device analysis and materials research.

Seamless integration of FIB and SEM for fast 3D imaging and ultra-precise milling

Enables nanoscale analysis and fabrication across various materials

Supports automated workflows (3D tomography, pattern milling, etc.)

Versatile applications in semiconductor device analysis, materials science, and biological sample observation