AQLASER | 아큐레이저

Company Name	AQLASER
Booth Number	A118
Home Page	www.aqlaser.com/
Contact	070-7813-0816

Company Introduction

AQLASER Co., Ltd., established in 2016, is a specialized manufacturer of semiconductor laser processing equipment. We have 
independently developed and hold a variety of laser processing technologies including laser bonding, cutting, and drilling used in both 
front-end and back-end semiconductor manufacturing.
Collaborating with major global corporations, AQLASER is emerging as a comprehensive semiconductor laser processing solution 
provider through technological internalization and strategic patent acquisition.

Introduction of Products

1. Glass Core Substrate(Laser Singulation & Laser Drilling System) (LDR Series, LS Series)

'1. TGV 
- In-house optical system design and assembly
- High-precision beam shaping technology (Bessel, Gaussian, Axicon, etc.)
- Experience in co-development with clients
- Process accuracy below 3μm, positioning accuracy under 1.5μm
- Capable of processing large panels over 515mm and double-sided multilayer glass substrates (0.2–1.8mm thickness)
- Supports multi-process for hybrid Glass + Polymer Film (HI) materials
- AR 1000 :1 (Laser Hole)

2. Singulation
- Chipping under 5μm and dimensional accuracy below 10μm
- Capable of processing large panels over 515mm and double-sided multilayer glass substrates (0.2–1.8mm thickness)
- Processing technology for ABF build-up layers under 500μm thickness
- SEWARE Free

2. Laser Bonding System (LTB Series, LR Series, LDB Series)

'- Flatness & alignment accuracy below 2μm
- High-speed bonding in 0.5–4 seconds
- Bonding accuracy of 1–10μm
- Selective bonding for chiplets and 3D packages
- Adjustable XY beam size
- Quartz-based high-durability bonding tool
- Localized temperature control by position

3. Heterogeneous Bonding, Bonding Material for Build-up Application

'1. Heterogeneous Bonding Technology
- Molecular bonding techniques and chemicals for dissimilar materials
- Surface plating technologies for various substrates
- High-performance thermal interface materials

2. Bonding Materials
- Build-up materials as alternatives to ABF films
- Low Dk, Df, and low CTE materials
- High-performance film and liquid materials optimized for glass substrates

3. Glass Direct Plating
- Electroless plating on TGV glass
- Prevention of micro cracks
- Development and supply of IMB (Interposer Metal Bump) plating solutions

4. High-Performance PI Materials
- Development and supply of advanced PI (polyimide) materials
- Development of glass-replacement materials using PI films