KOSTECSYS | 코스텍시스

Company Name	KOSTECSYS
Booth Number	A103
Home Page	www.kostec.net/
Contact	032-821-0162

Company Introduction

KOSTECSYS is an advanced materials and semiconductor packaging company for AI and power infrastructure. We provide high-
performance solutions based on low-CTE, high-thermal-conductivity, and block bonding technologies.

Introduction of Products

1. Embedded Copper Coin

KOSTEC’s Embedded T/I-Coin and Stepped Copper Coin are customized copper coin solutions that optimize thermal paths for chip 
embedding and high-power devices, improving heat dissipation, reliability, and power efficiency.

2. Block Bonding

KOSTEC’s next-generation power semiconductor platform uses block bonding for SiC/GaN applications, integrating spacers, T/I-Coins, 
and Cu blocks to deliver high power density, superior heat dissipation, and electrical stability.

3. High thermal metal ceramic packaging

KOSTEC’s high-thermal metal-ceramic packaging combines a 320 W/m·K substrate with a precision metal housing to deliver superior 
heat dissipation, mechanical stability, and EMI shielding for optical transceivers and RF power amplifiers.