ALKYNES | 알킨스

Company Name	ALKYNES
Booth Number	E110
Home Page	www.alkyn.com/
Contact	031-683-8124

Company Introduction

Alkynes Co., Ltd. develops functional tapes for electric, electronic, auto, and industrial sectors, including semiconductor process, EMI 
shielding, and thermal tapes, advancing technology through R&D.

Introduction of Products

1. HBM Dicing Tape (ALKYN-M120)

Optimized for HBM wafer dicing, this domestic tape offers long-term adhesive stability, film elongation under temperature change and 
ensuring clean pick-up performance.

2. HBM Back Grinding Tape (ALKYN-LD105)

Specialized for HBM buffer wafer backgrinding, this tape stably embeds fine bumps, resolves wafer damage from glue processes, blocks 
moisture, offers heat resistance, and delaminates cleanly.

3. Normal Dicing Tape (ALKYN-M090)

A PVC-based domestic tape for general wafer dicing, maintaining stable adhesion for reliable handling, with back-chipping prevention, 
high pick-up success, and adhesion optimized for PVC substrates.

4. Normal Back Grinding Tape (ALKYN-LS440)

This backgrinding tape protects large bumps while thinning the wafer, suited to special specs for high-voltage parts, delivering 
thickness uniformity, workability, and clean delamination.