KORNIC SEMITECH | 코닉세미텍

Company Name	KORNIC SEMITECH
Booth Number	G124
Home Page	www.kornicsemi.com/
Contact	031-431-3835

Company Introduction

Kornic Semitech is a company specializing in semiconductor and power semiconductor manufacturing equipment, providing ultra-
precision blade dicing systems and laser grooving solutions for advanced processing applications. The company also delivers 
customized automation systems, including sorting and handler equipment, supported by reliable engineering expertise and technical 
services.

Introduction of Products

1. Laser Grooving System (KSLD4410 (Laser Grooving))

'- Femtosecond Laser Processing with Ultra-Short Pulse Technology
- Ultra-Precision Grooving with Minimal Heat Affected Zone (HAZ)
- Non-Contact Machining for Reduced Mechanical Stress
- High Accuracy Vision Alignment and Auto Calibration
- Optimized for Semiconductor and Power Semiconductor Applications
- Stable High-Speed Processing with Advanced Motion Control
- Real-Time Process Monitoring and Recipe Management
- Compact and User-Friendly System Design

2. KD642 (Dicing saw machine) (KD642 (Dicing saw machine))

'- High-Power Spindle for Stable High-Speed Cutting Performance
- Full Auto System for Production Operation
- Ultra-Precision Blade Dicing Capability
- High-Rigidity Machine Structure to Minimize Vibration and Process Deviation
- Low Chipping and Excellent Cutting Quality
- Optimized for Semiconductor and Power Semiconductor Wafer Processing
- High Accuracy Vision Alignment and Auto Compensation Function
- Flexible Process Capability for Various Material Applications
- Real-Time Process Monitoring and Automatic Recipe Management
- High-Speed Motion Control for Stable Mass Production Efficiency