COFA | 코파

Company Name	COFA
Booth Number	C121
Home Page	www.cofa.co.kr/
Contact	010-9245-7848

Company Introduction

COFA Co., Ltd. is a simulation-driven company innovating advanced packaging underfills and semiconductor adhesives. We proactively 
solve client challenges, reducing process steps and costs. Moving beyond localization, we aim to secure global markets through cutting-
edge R&D, establishing ourselves as a premier semiconductor manufacturing platform company.

Introduction of Products

1. HBM,2.5D,3D packaging Underfill (COFA 4000 Series)

COFA Co., Ltd.’s B-Stage underfill is an HBM adhesive pre-coated at the wafer level and pre-cured (B-Stage) before dicing, stacking, and 
final curing. Integrating flux functionality eliminates reflow, cleaning, and dispensing steps, drastically reducing process stages. Driven 
by simulation technology to control warpage and voids, it simultaneously maximizes production yield and minimizes manufacturing 
costs through HBM process simplification.

2. CUF Underfill (COFA 4100 Series)

COFA’s dual-cure CUF underfill ensures excellent flowability even at a 40㎛ fine pitch. It precisely controls flow via a temperature-
dependent dual-cure mechanism on the bottom PCB. Compatible with any dispenser (Jet, Pneumatic), it can be modified to fit specific 
client process conditions, serving as an innovative solution that maximizes packaging yield.