SK HYNIX | SK하이닉스

Company Name	SK HYNIX
Booth Number	G102
Home Page	www.skhynix.com/
Contact	031-5185-4114

Company Introduction

We are a leading semiconductor company specializing in DRAM and NAND flash memory. 
As a Full Stack AI Memory Creator, we deliver high-performance memory solutions that power the world's most demanding AI, cloud, 
and mobile innovations.
Built on reliability and efficiency, our technology forms the foundation of advanced AI environments — shaping a smarter, more 
connected future for everyone.

Introduction of Products

1. Memory Package (HBM (High Bandwidth Memory))

HBM is an high bandwidth memory packaging solution designed for next-generation AI and high-performance computing. By stacking 
multiple DRAM dies using TSV technology, it delivers overwhelming data processing speeds and power efficiency. SK hynix continuously 
advances its proprietary MR-MUF process, ensuring proven reliability and superior compatibility with SiP.

2. Memory Package (VFO (Vertical Fan-Out))

VFO is a next-generation vertical connection packaging solution that overcomes the limitations of horizontal wiring. Through a 
proprietary process, it achieves vertical high-density interconnects, realizing ultra-fine pitch and high integration. This maximizes signal 
transmission speed and power efficiency, providing a thin and high-heat-dissipation packaging solution tailored for high-performance 
demands.