SMITHS INTERCONNECT

Company Name
Booth Number	C120
Home Page	www.smithsinterconnect.com/
Contact	8918951118300

Company Introduction

Smiths Interconnect, a Molex company, is a leading provider of high reliability connectivity products and solutions serving segments of 
aerospace and defense, medical, semiconductor test and industrial markets. It designs and manufactures technically differentiated 
electronic components, as well as microwave, optical and radio frequency products and sub-systems that connect, protect and control 
critical applications.

Smiths Interconnect is part of Molex, which combined, includes over 90 plants across 22 countries with a global headcount to over 
55,000 employees.

Introduction of Products

1. high speed test socket DaVinci Gen V

The next generation of high-performance semiconductors—from advanced Consumer SoCs and GPUs to AI Accelerators and Data Center 
processors  demands unprecedented bandwidth and speed. Yet as data rates climb, ensuring signal integrity during testing becomes 
exponentially more difficult. Even slight impedance mismatches or signal degradation can trigger false failures, compromise yields, and 
delay critical product launches.

Engineered to overcome these challenges, the DaVinci Gen V coaxial test socket provides an out-of-box solution for full functional 
testing of cutting-edge ASICs. Its precision design guarantees unmatched signal integrity, eliminating measurement errors while 
delivering lab-grade accuracy and repeatability in production environments.

2. Volta series probe card

Smiths Interconnect’s Volta 180 Series Probe Head addresses the need for reduced test time and increased
throughput in high reliability testing of Wafer Level Packages (WLP), Wafer Level Chip Scale Packages (WLCSP) and Known Good Die 
(KGD).

The Volta 180 Series is capable of testing sorted die for engineering development or failure analysis. Volta 180
Series offers a high performance, cost-effective, easily maintainable alternative to cantilever and vertical probe card technologies.