LETECHNUS | 리테크너스

Company Name	LETECHNUS
Booth Number	L111
Home Page	-
Contact	010-8165-1992

Company Introduction

Letechnus delivers domestically developed semiconductor materials including patented Si-Parts and carbon fiber diamond wire with 
high yield rates and cost efficiency for next-gen advanced packaging.

Introduction of Products

1. Semiconductor Process Silicon Parts (Si-Parts) (WLJ-SiNx Silicon Electrode)

Advanced Si electrode for etching with water-jet laser machining and Si₃N₄ coating, delivering zero particles, ±15 μm precision, 30% 
faster processing, and longer lifetime.

2. Carbon Fiber Diamond Wire (LTN-CFD)

A carbon fiber core-based diamond wire optimized for SiC/GaN wafer slicing, delivering tensile strength ≥3,600 N/mm² and fracture 
load ≥60N to minimize wire breakage and reduce kerf loss.