GANA | 가나

Company Name	GANA
Booth Number	B121
Home Page	ganatr.co.kr
Contact	031-398-5110

Company Introduction

A company specializing in cutting-edge bonding solutions, with a variety of high-potential and reliable equipment, Precision die bonder, 
flip chip bonder, wire bonder, state-of-the-art equipment, etc.
This company provides One Bonding Solution.

Introduction of Products

1. Sub-micron Die bonder (Pico2)

The FINEPLACER® pico 2 is a multi-purpose, manual die bonder with placement accuracy down to 3 µm. Quick to set up and easy to 
operate, the system is ideal for fast and flexible product development and prototyping in R&D labs and universities.

2. Vacuum Reflow Solder system (Reflow Solder System)

We offer different kind of table top and space saving systems (for R&D use, for prototyping and small series production).
RSO: Reflow Solder Oven RSO-210 (up to 650 °C)
RSS: Mini Reflow Solder System RSS-110-S, RSS-160-S, RSS-210-S (max. temp. 400 °C)
VSS: Vacuum Solder System (up to 400 °C) also for flux