IPT | 아이피티

Company Name	IPT
Booth Number	I108
Home Page	www.ip-t.co.kr
Contact	032-520-6119

Company Introduction

IPT supplies state-of-the-art equipment and materials in the power semiconductor field and provides optimal solutions tailored to 
customer needs. We provide the highest quality and services based on our professional expertise and know-how, and grow together 
with our customers based on trust.

Introduction of Products

1. SINTER BONDING SYSTEM (Fusion X-100)

'- Supports both Pressure and Pressure-less Sintering
- Sintering Force: up to 20 Mpa
- Process Atmosphere: Air, N2, Forming Gas, Vacuum, Formic acid(under delevopment)

2. TLPB PREFORM (PFDS® 400)

'- TLPB(Transient Liquid Phase Bonding) Preform
- Remelting temperature above 400 ℃
- Metallic core(Cu-HCP/C10300, Ag, Ni) double-coated with lead-free solder layers(Sn/In-based)