듀라소닉

Company Name
Booth Number	H102
Home Page	www.durasonic.com
Contact	031-684-5489

Company Introduction

Based on advanced ultrasonic cleaning technology, Durasonic has been growing 
into a global TOP MAKER, providing customers with fully automated optimal 
cleaning solutions from consulting, design, manufacturing and maintenance of 
various cleaning systems in semiconductors, displays, mobile devices, lenses, 
secondary batteries, and automobile parts industry.
At the 2025 Exhibition on Next-Generation Semiconductor Packaging, we introduce the Stencil 
Mask Cleaning System(Mercury), Deflux Cleaning System(Poseidon) which are 
semiconductor-related cleaning system.
Durasonic will do its best to become the best global leader in the semiconductor 
precision cleaning industry.

Introduction of Products

1. Stencil Mask Cleaning System (DURA-ST)

▶ Dual Nozzle Stencil Mask Cleaning
▶ Applicable Mask Size - For Semiconductor : MAX. 800 x 800 x 40
                                - For SMT : 650 x 550 x 30
▶ Drying - Wing blower hot air drying
               Hot air drying using utility air
▶ Cleaning time - 8 to 15 minutes depending on the degree of contamination 
                         (settable)
▶ Features :
  1) Designing the mask transfer structure through the stage for convenience 
     of mask insert and collection.
  2) Use a 20-inches parallel regeneration filter to increase the filter's 
     replacement cycle and ALARM SYSTEM for filter replacement period 
     with digital pressure sensor.
  3) Cleaning tank and rinsing tank are completely separated, allowing 
     operators to selectively use cleaning agents and DI-water cleaning.
  4) Automatic water supply system of cleaning water and DI-water

2. Deflux Cleaning System (DURA-DF)

▶ Cleaning system that removes fluxes and related foreign substances from 
    semiconductor packaging and PCB process
▶ Cleaning process : Chemical Cleaning > Chemical Isolation > DI-water Rinsing
                          > Final Rinsing > Air Knife > Drying
▶ Features :
1) Remove flux residue and foreign substances after OVEN operation of various 
   PCB, BGA (FC BGA, P BGA, CSP, MCP, etc.) of semiconductor.
2) SPRAY type cleaning system using cleaning water and DI-water, and SPRAY 
   pressure discharge of 0.3Mpa to 0.7Mpa.
3) Basically, the rail is designed with Mesh type, but it can also be made with 
   Pin type rail depending on options and processes