AJIN ELECTRONNICS | 아진전자

Company Name	AJIN ELECTRONNICS
Booth Number	B120
Home Page	www.ajinelec.com
Contact	070-7834-5227

Company Introduction

We are specialized in R&D field supplying comprehensive R&D solution service as both consignment development and test-bed based 
on the flip-chip packaging process, which is gradually expanding its application scope in semiconductor manufacturing.
Based on our own LAB facilities with the long term of technical know-how, we provide unique test-bed service by suggesting technical 
ideas in Korea that allow customers to experience short-term of product development and to review the trial and errors in advance.
We suggest clients with the optimized TEG substrate design, manufacturing know-how, implementation of verification service which are 
necessary for flip-chip process development. We challenge and lead the development of next-generation technology generating from 
the demand of future industry by cooperating steadily with the materials suppliers and equipment manufacturers.

Introduction of Products

1. Glass interposer package

Glass interposer package

2. TEG Sub

TEG Sub