AKC | 에이케이씨

Company Name	AKC
Booth Number	C102
Home Page	www.akcco.com
Contact	031-8015-5099

Company Introduction

Since 1994, we have been supplying automatic exposure devices, a key facility in the PCB manufacturing process, to Korea. We continue 
to grow rapidly based on strategic partnerships with the best PCB companies based on excellent technology and customer-oriented, 
quick and accurate service service. In recognition of this ability, we are making a leap into a world-class company by diversifying our 
businesses by expanding our handling fields throughout the PCB process.                         Through these continuous efforts since our 
founding, we have been increasing our position by handling clean machines and PCB-related materials used in various processes, 
including automatic exposure equipment, AOI, and AFVI, which are the core of the PCB process. Furthermore, we have established an 
R&D center and are continuously researching and developing new products tailored to market needs, and are producing semiconductor 
PKG Via Hole inspection machines from the first half of 2021.

Introduction of Products

1. LASER Via Hole Inspection Machine (PAVIS-30LV / PAVIS-50LV / PAVIS-70LV)

World's first Color Laser Via Hole AOI, developed with AKC's proprietary technology
-. Precise inspection down to via bottom residue using a color optical system
-. AI inspection algorithm based on high-resolution color imaging
-. Inspects key control items such as hole size, hole position, pitch, and roundness
-. Process quality control and traceability support based on SPC data
-. Supports integration with VMS, RMS, ITS, and AI analysis systems

2. Glass Through Glass Via AOI Inspection Machine (PAVIS-10TGV / PAVIS-30TGV / PAVIS-50TGV)

High-speed AOI inspection system dedicated to the glass substrate manufacturing process
-. Inline inspection that high-speed scans the entire glass surface without flipping the product
-. Supports inspection of surface, laser modification, etching, and Cu plating processes
-. Inspects various defects such as TGV hole size, position, crack, and Cu defect
-. Applies high-precision optics and a high-speed line scan camera
-. Supports production history management and quality analysis based on SPC data

3. Transparent Substrate Analysis Equipment (PAVIS-TSA)

Automatic position alignment and precision analysis system based on AOI inspection coordinates
-. Analysis of internal glass shape and defects through non-destructive 3D analysis
-. Analyzes surface crack, laser modification, TGV roughness, and Cu filled crack
-. Supports precision metrology of diameter, taper, roughness (Ra), profile, etc.
-. Provides process history and root cause analysis linked with AOI data
-. AI-based analysis result management and process insight