HIMS | 힘스

Company Name	HIMS
Booth Number	K109
Home Page	www.hims.co.kr
Main Phone	032-821-2511

Company Introduction

Since its establishment in 1999, HIMS Co., Ltd. has continuously achieved success in the fields of general automation, display, and 
semiconductor industries through machine vision technology. In the semiconductor sector, the company has led the machine vision 
industry by developing and researching various applications, including the IR Inner Crack Inspection System, Overlay Inspection 
System, Wafer Bump Inspection System, and CIS/DDI Wafer AOI System, as well as SMT 2D/3D AOI Systems. More recently, HIMS has 
expanded into the PCB industry by developing and commercializing AFVI + AI + VRS machine systems.

Introduction of item

1. IR Die Inner Crack Inspection System

HSSMIR-4000

Spec: Vision system :
1) Inner crack & Damage
2) Line scan type & NIR[Near InfraRED] Camera
(SWIR camera available)

Features: Die surface and Diee internal crack and chipping inspection